MicroAGI — MK1
CWX-2026-0001  ·  Confidential
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MicroAGI — MK1 Smart Glasses
CWX-2026-0001  ·  Confidential Client Portal  ·  ChinaWorx
Last updated: Apr 27, 2026
In Development
Hardware Development Tracker
Dual-Camera Smart Glasses — AI Data Aggregation Platform
This portal gives MicroAGI real-time visibility into all development milestones, engineering deliverables, and factory activity for the MK1 platform — a dual-camera AI data aggregation wearable engineered in Shenzhen. The project covers industrial design through pilot production and mass manufacturing, managed by ChinaWorx.
MicroAGI MK1 Smart Glasses — Product Render V1.46
Development Phase
02 / 04
Structural DFM + PCBA
Days in Development
45
Since Mar 13, 2026
Overall Progress
28%
Phase 1 delivered
Next Milestone
May 5
Camera PCBA Samples
Development Phases — Overview
✓
Phase 1 — Industrial Design & Initiation
ID brief, form factor definition, CMF requirements confirmed. Product render V1.46 delivered. PM plan and full team assignments finalised. Factory NDA signed.
Completed · March 2026
02
Phase 2 — Structural DFM + PCBA Development
3rd structural CAD review completed Apr 24 — three high-priority changes in progress. Mainboard schematic and camera module PCBA prototyping underway. Tooling kick-off pending.
Active · ~40% complete · Est. Jun 2026
03
Phase 3 — Engineering Validation (EVT)
First physical prototypes assembled. Dual-camera FSYNC sync, WiFi 6, IMU, and battery life validated. Issues resolved before DVT.
Pending · Q3 2026
04
Phase 4 — Pilot Production + Certification
Small-batch pilot run, reliability testing, CE / FCC / RoHS certification. Production-ready BOM locked. MP material prep from Jun 1, 2026.
Pending · Q3–Q4 2026
Recent Activity
Action RequiredApr 24, 2026
3rd structural CAD review (V3) completed. Three high-priority design changes required before 2nd prototype build: temple arm folding interference, sharp corner temporal pressure, insufficient nose bridge flex. All assigned to Zhang Qing.
Structural Engineering — Gaia Premiums Ltd
ElectricalApr 17, 2026
Mainboard PCBA schematic review started. Dual MIPI SC233HGS array with FSYNC sync confirmed on SSC8826Q. Camera module PCBA prototyping scheduled — samples expected May 5, 2026.
Electrical Engineering — Feng Dong
MilestoneApr 7, 2026
Project management plan finalised. Nine-phase roadmap confirmed with full team assignments across structural, electrical, and production workstreams.
Project Lead — Kai Faerber / ChinaWorx
KickoffMar 20, 2026
Project kicked off. Mainboard definition, appearance brief, functional requirements, and BOM scope confirmed with MicroAGI. Factory NDA signed. Reference CWX-2026-0001 assigned.
Project Lead — ChinaWorx
⚠ Action Required from MicroAGI
01
Validate CAD with 3D Print Testing
The 3rd structural review (V3) has identified three high-priority design issues requiring physical validation — temple arm folding interference, nose bridge flex, and corner pressure points. MicroAGI to review the CAD review report and confirm sign-off on proposed geometry changes before the 2nd prototype build can proceed.
⚠ Blocking next prototype build
02
Confirm CMF Requirements Document
Colour, material, and finish requirements have not yet been formally signed off. CMF confirmation is required before tooling kick-off to ensure surface finish, coating specs, and material grades are locked into the production design.
⚠ Required before tooling kick-off
Full Task Breakdown — All Phases
PH01 Appearance Design DONE +
#
Task
Owner
Target
Status
1.1Industrial Design — ID & CMF requirementsFei Kai2026-04-01DONE
PH02 Project Initiation DONE +
#
Task
Owner
Completed
Status
2.1Project Kick-off — mainboard definition, appearance, functional brief, initial BOMFei Kai2026-03-20DONE
PH03 Structural Development ACTIVE −
#
Task
Owner
Target
Status
3.1Structural Design — 3D model & CMFZhang Qing2026-04-07ACTIVE
3.23D Review & Adjustment — 3rd review done 2026-04-24; 3 high-priority changes in resolutionZhang QingTBDACTIVE
3.3Mainboard / Camera Module Outline — PCBA outline drawingZhang Qing2026-04-07ACTIVE
3.42D Drawings & BOMZhang QingTBDPENDING
3.5Cost Calculation & Commercial ConfirmationHuang YanTBDPENDING
3.6Tooling Kick-off to T0 — 45 daysFeng DongTBDPENDING
3.7Tooling T1 trialFeng DongTBDPENDING
PH04 Mainboard PCBA Development ACTIVE −
#
Task
Owner
Target
Status
4.1Schematic Design ReviewFeng Dong2026-04-17ACTIVE
4.2PCBA Prototyping — samples & component specificationsFeng Dong2026-05-07ACTIVE
4.3SW Debug — Initial Version 1.0 (23 days)Feng DongTBDPENDING
4.4SW Testing — Initial Version 1.0Feng Dong / Tang WenbingTBDPENDING
4.5SW Update & Testing — Pilot Version 2.0TBDTBDPENDING
4.6Pilot Software Release — test report & test casesTBDTBDPENDING
PH05 Camera Module Development ACTIVE −
#
Task
Owner
Target
Status
5.1Schematic Design ReviewFeng Dong2026-04-17ACTIVE
5.2PCBA Prototyping — samples & component specificationsTBD2026-05-05ACTIVE
5.3Assembly & FocusingTBDTBDPENDING
PH06 Packaging Development PENDING +
#
Task
Owner
Target
Status
6.1Packaging Design RequirementsLi Chuqian2026-04-15PENDING
6.2Packaging Drawing DesignTBDTBDPENDING
6.3SamplingTBDTBDPENDING
6.4Packaging Sample Approval — 3 setsTBDTBDPENDING
PH07 Pilot Production PENDING +
#
Task
Owner
Target
Status
7.1Material Approval & Preparation (30 days)Huang / Li / YangTBDPENDING
7.2Pilot Production — small batchProductionTBDPENDING
7.3Testing — reliability test reportQualityTBDPENDING
7.4Pilot Summary & Mass Production ReviewProd / QualityTBDPENDING
7.5Bulk Production Sample Approval — 4 sets + spec + SW + BOMCommercialTBDPENDING
PH08 Mass Production — First Order PENDING +
#
Task
Owner
Target
Status
8.1Material Preparation — lead time schedule (40 days)Liu / Li / Yang2026-06-01PENDING
8.2Mass Production — first batchProductionTBDPENDING
8.3Inspection & ShipmentCommercialTBDPENDING
PH09 Certification PENDING +
#
Task
Owner
Target
Status
9.1Certification ApplicationTBD2026-06-01PENDING
9.2Certification Report Issuance (45 days) — CE / FCC / RoHSTBDTBDPENDING
Deliverables & Documentation
📐
CAD Structural Review Report
3rd iteration · V1→V3 · Apr 24, 2026
Apr 24 · Review & action required
🧮
3D STEP File — MK1 Assembly
V3 exploded · Apr 21, 2026
Delivered · Apr 21
📊
Project Management Plan
9 phases · Full team · Gantt
Delivered · Apr 7
📋
SSC8826Q SoC Datasheet
Sigmastar · v0.9 · Cortex-A53 Dual
Reference document
🖼
Product Render — MK1 V1.46
KeyShot · Mar 26, 2026
Delivered · Mar 26
Hardware Specifications — MK1 (Confirmed)
Core Hardware
SoCSigmastar SSC8826Q
CPUARM Cortex-A53 ×2 · 800MHz
Cameras2× SC233HGS (Global Shutter)
Resolution1080P @ 30fps · H.265
FOV≥160° diag / ≥80° vert
IMUICM-42607-C ×2 · 1000Hz
PCBA size≤60 × 20mm · 0201
Power & Connectivity
Battery3.7V / 1000mAh LiPo
Runtime≥1.5h continuous rec.
WiFiWiFi 6 · 2.4 + 5GHz
BluetoothYes
StorageTF Card + eMMC (≥32GB)
InterfaceUSB-C · charge + data
Sync precision≤10ms IMU–video
Confidential · MicroAGI · CWX-2026-0001 · Updated Apr 27, 2026
Project Lead — Kai Faerber · info@china-worx.com
Factory Partner — Gaia Premiums Ltd, Shenzhen
Client — MicroAGI, DE